We are pleased to announce the availability of student travel grants for IEEE DySPAN 2012, funded by NSF. Travel grants to attend the conference will be offered to prospective students in US universities.
Application Procedure
An application for a student travel award will consist of:
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A letter from the student, including paper title if a paper or poster has been accepted for IEEE DySPAN 2012. See further details below.
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The student's vita.
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An estimate of the following costs of attending IEEE DySPAN 2012: airfare, hotel, and conference registration. It is anticipated that travel grants will partially cover these costs of attendance.
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A supporting letter from the student's graduate advisor. See further details below.
The letter from the student should include (at most 1 page):
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A brief summary of research interests and accomplishments to date, including the title of any paper or posted accepted for presentation at IEEE DySPAN 2012.
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A description of areas reflected in the IEEE DySPAN 2012 program that would impact the student's research.
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A statement about why the conference attendance is important to the student.
The advisor's recommendation letter for the student should include:
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Confirmation that the student is a bona fide Ph.D. or M.S. candidate in good academic standing at the given institution.
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Ways this particular student would benefit from attendance at the conference.
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The strengths and potential contributions of the student.
Student applicants should submit their applications via email to
Prof. Maria Papadopouli (mgp@ics.forth.gr) with subject title "IEEE DySPAN 2012, Student Travel Grant Application". Applicants should create a single PDF file containing items 1-3 of the application package (the student's letter, the student's vita, and an estimate of cost).
The advisor's recommendation letter should be sent from the advisor directly via email to Prof. Maria Papadopouli with subject title "IEEE DySPAN 2012, Recommendation Letter for Student Travel Grant".
The deadline for the applications is September 4th, 2012.
